Rectangular Fusion bounds after binary Waring compilation #
The degree-parametric compiler satisfies a one-term critical-layer decomposition at every multiplication. Consequently every rectangular split and the optimized split profile yield ordinary arithmetic-circuit lower bounds, with exact source-to-target cost accounting.
Circuit-level rectangular critical-layer restriction.
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Instances For
A zero-or-one-power critical layer is a one-term Waring decomposition.
Every atom in a rectangular binary contextual gadget satisfies the local critical-layer multiplication property.
Compiled rectangular Waring circuits satisfy the exact critical-layer restriction.
Every compiled multiplication has a one-term critical-layer decomposition, uniformly across all rectangular splits.
Rectangular compilation preserves construction of the squarefree target.
Every split gives its full choose degree split multiplication lower
bound on the compiled ordinary arithmetic circuit.
The maximum certified over every split is also a compiled-circuit lower bound.
The rank-one profile specializes exactly to the middle rectangular split.
Exact source-term tradeoff at an arbitrary rectangular split.
Closed source-term tradeoff using the logarithmic binary-power bound.